Process discharge gas polluted material removal device with regenerating means of polluted oxidation catalyst

ABSTRACT

A process discharge gas polluted material removal device with a regenerating means of a polluted oxidation catalyst includes: an oxidation catalyst tower connected to a pipe circulating a process discharge gas including a combustible material, an organic material, an inorganic material, and nitrogen oxide and having a first temperature and having an oxidation catalyst embedded therein, the oxidation catalyst oxidizing and removing the combustible material; and a plasma reactor connected to the oxidation catalyst tower in front of the oxidation catalyst, generating a synthesis gas including hydrogen and having a high temperature of 300° C. or more by a plasma reaction, and supplying the synthesis gas including the hydrogen to the oxidation catalyst to regenerate the oxidation catalyst poisoned by the organic material and the inorganic material.

TECHNICAL FIELD

The present invention relates to a process discharge gas pollutedmaterial removal device with a regenerating means of an oxidationcatalyst polluted due to removal of a process discharge gas pollutedmaterial.

BACKGROUND ART

An oxidation catalyst is used to remove combustible polluted materialssuch as CO and HC generated and discharged at industrial sites, and aselective catalytic reduction (SCR) is used to remove nitrogen oxide(NOx). That is, Co and HC included in a process discharge gas may beoxidized through the oxidation catalyst, and NOx may be reduced throughthe SCR.

However, an oxidation catalyst may be rapidly poisoned by very smallamounts of organic material and inorganic material included in theprocess discharge gas depending on a kind of process. In addition, theSCR should be maintained at a startup temperature of 230° C. or more inorder to remove NOx.

In the case in which a temperature of the process discharge gasdepending on a process is low, the temperature of the process dischargegas is increased by heating the process discharge gas, and the SCR maythus remove NOx.

When the poisoned oxidation catalyst is regenerated in a hightemperature condition, the organic material is oxidized and removed fromthe oxidation catalyst, such that reactivity of the oxidation catalystmay be recovered. However, in the case of the inorganic material,reactivity of the oxidation catalyst is not recovered only by simplyprocessing the oxidation catalyst at a high temperature.

For example, oxidation conversion rates of CO and HC by the oxidationcatalyst is maintained at a first level in a first high temperaturecondition in a state in which the oxidation catalyst is not poisoned,and is rapidly decreased to a second level lower than the first levelwhen the oxidation catalyst is poisoned by the inorganic material.

In the case of regenerating the oxidation catalyst only by simplyprocessing the oxidation catalyst at the high temperature in this state,even though the first high temperature condition is again provided, theoxidation conversion rates are not recovered to the first level, butshows performance lower than the first level due to the poisoning of theoxidation catalyst by the inorganic material.

Therefore, in the case in which the inorganic materials may not beremoved on the oxidation catalyst, activity of the oxidation catalyst isdecreased due to the inorganic materials remaining on the oxidationcatalyst.

DISCLOSURE Technical Problem

The present invention has been made in an effort to provide a processdischarge gas polluted material removal device with a regenerating meansof a polluted oxidation catalyst having advantages of effectivelyregenerating an oxidation catalyst polluted by a process discharge gasincluding a combustible material, an organic material, an inorganicmaterial, and XOx.

Technical Solution

An exemplary embodiment of the present invention provides a processdischarge gas polluted material removal device with a regenerating meansof a polluted oxidation catalyst, including: an oxidation catalyst towerconnected to a pipe circulating a process discharge gas including acombustible material, an organic material, an inorganic material, andnitrogen oxide and having a first temperature and having an oxidationcatalyst embedded therein, the oxidation catalyst oxidizing and removingthe combustible material; and a plasma reactor connected to theoxidation catalyst tower in front of the oxidation catalyst, generatinga synthesis gas including hydrogen and having a high temperature of 300°C. or more by a plasma reaction, and supplying the synthesis gasincluding the hydrogen to the oxidation catalyst to regenerate theoxidation catalyst poisoned by the organic material and the inorganicmaterial.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further includea reduction catalyst tower connected to the oxidation catalyst tower andhaving a selective catalytic reduction embedded therein, the selectivecatalytic reduction removing the nitrogen oxide included in a processdischarge gas having a second temperature higher than the firsttemperature.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further includea first control valve performing a selection so as to allow the processdischarge gas having the first temperature to be supplied from the pipeto the oxidation catalyst or allow the process discharge gas having thefirst temperature to bypass the oxidation catalyst and be supplied tothe reduction catalyst tower.

The selective catalytic reduction may be heated to a startup temperatureby the process discharge gas passing through the oxidation catalyst andhaving the second temperature.

The plasma reactor may include: a housing including a fuel supply portand an air supply port disposed at one side thereof, including adischarge port disposed at the other side thereof, and grounded, thedischarge port discharging the synthesis gas including the hydrogen; andan electrode provided between the fuel supply port and the air supplyport and having a voltage applied thereto.

The housing may include a plasma reaction space extended between a frontof the electrode and the discharge port.

The plasma reactor may further include a reforming catalystcommunicating with a plasma reaction space formed between the fuelsupply port and the air supply port, and the discharge port of thehousing.

The plasma reactor may include a fuel additional supply port and an airadditional supply port provided between the plasma reaction space of thehousing and the reforming catalyst to additionally supply a fuel andair.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further includea bypass pipe connecting the first control valve to the oxidationcatalyst tower so that the process discharge gas bypasses the oxidationcatalyst.

The oxidation catalyst tower may include a first oxidation catalysttower and a second oxidation catalyst tower disposed in parallel witheach other and selectively connected to the selective catalyticreduction by a second control valve, and the first control valve mayselectively connect the pipe to the first oxidation catalyst tower andthe second oxidation catalyst tower in front of the oxidation catalyst.

The plasma reactor may be selectively connected to the first oxidationcatalyst tower and the second oxidation catalyst tower through a thirdcontrol valve.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further include:a first control valve provided in front of the oxidation catalyst towerand intermitting the process discharge gas supplied to the oxidationcatalyst tower and having the first temperature; and a second controlvalve provided behind the oxidation catalyst tower and intermitting theprocess discharge gas supplied to the oxidation catalyst tower andhaving the second temperature.

The plasma reactor may be installed on a bypass pipe connecting thefirst control valve and the second control valve to each other andgenerate a plasma reaction by the process discharge gas circulatedthrough a closed loop formed by selection operations of the firstcontrol valve and the second control valve and having the firsttemperature and separately supplied air to generate the synthesis gasincluding the hydrogen and having the high temperature of 300° C. ormore.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further includean ozone generator connected to the oxidation catalyst tower in front ofthe oxidation catalyst and supplying ozone.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst may further includea bypass pipe having one side connected to the oxidation catalyst towerbehind the oxidation catalyst and the other side connected to the pipethrough a first control valve so that the process discharge gas bypassesthe oxidation catalyst.

The oxidation catalyst tower may include a first oxidation catalysttower and a second oxidation catalyst tower disposed in parallel witheach other and selectively connected to the selective catalyticreduction by a second control valve, and the first control valve mayselectively connect the pipe to the first oxidation catalyst tower andthe second oxidation catalyst tower in front of the oxidation catalyst.

A supply pipe connected to the plasma reactor and the ozone generator toselectively supply the hydrogen and the ozone may selectively connectthe plasma reactor to the first oxidation catalyst tower and the secondcatalyst tower through a third control valve, and selectively connectthe ozone generator to the first oxidation catalyst tower and the secondoxidation catalyst tower through a fourth control valve.

The first oxidation catalyst and the second oxidation catalyst may beformed in one stage or plural stages within the first oxidation catalysttower and the second oxidation catalyst tower, respectively.

Air supplied to the plasma reactor may be set to 10 to 100% of acombustion equivalent ratio.

The reduction catalyst tower may be provided behind the oxidationcatalyst tower.

The first control valve may intermit the process discharge gas suppliedfrom the pipe to the oxidation catalyst tower and having the firsttemperature, and the second control valve may intermit the processdischarge gas supplied from the oxidation catalyst tower to thereduction catalyst tower and having the second temperature.

The reduction catalyst tower may be provided in front of the oxidationcatalyst tower and be connected to the pipe, and a heat exchanger may beinstalled on the pipe and a rear pipe of the oxidation catalyst tower.

The first control valve may intermit the process discharge gas suppliedfrom the reduction catalyst tower to the oxidation catalyst tower andhaving the first temperature, and the second control valve may intermitthe process discharge gas supplied from the oxidation catalyst tower tothe heat exchanger and having the second temperature.

Another exemplary embodiment of the present invention provides a processdischarge gas polluted material removal method with a regenerating meansof a polluted oxidation catalyst, including: a first step of blocking aprocess discharge gas to allow the process discharge gas to bypass apoisoned oxidation catalyst, in order to regenerate the poisonedoxidation catalyst; a second step of supplying hydrogen generated bydriving a plasma reactor to the poisoned oxidation catalyst to remove aninorganic material of the poisoned oxidation catalyst; a third step ofblocking the supply of the hydrogen by stopping an operation of theplasma reactor when a predetermined time elapses after the plasmareactor is driven; a fourth step of supplying ozone generated by drivingan ozone generator to the poisoned oxidation catalyst to remove anorganic material of the poisoned oxidation catalyst; and a fifth step ofblocking the supply of the ozone by stopping an operation of the ozonegenerator, releasing the bypass of the process discharge gas for thepoisoned oxidation catalyst, and introducing the process discharge gasinto the poisoned oxidation catalyst, when a predetermined time elapsesafter the ozone generator is driven.

In the first step, the oxidation catalyst poisoned by the inorganicmaterial may be regenerated in a condition in which a temperature of theprocess discharge gas is higher than a set value (350° C.).

The third step may be performed at a temperature of the processdischarge gas higher than a set value to remove the inorganic material,and the fourth step may be performed at a temperature of the processdischarge gas lower than the set value to oxidize and remove the organicmaterial.

Advantageous Effects

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst according to anexemplary embodiment of the present invention may effectively regeneratean oxidation catalyst polluted from a combustible material, an organicmaterial, an inorganic material, and NOx.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a first exemplary embodiment of thepresent invention.

FIG. 2 is a cross-sectional view illustrating a plasma reactor appliedto FIG. 1.

FIG. 3 is a cross-sectional view illustrating another plasma reactorapplied to FIG. 1.

FIG. 4 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a second exemplary embodiment of thepresent invention.

FIG. 5 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a third exemplary embodiment of thepresent invention.

FIG. 6 is a flowchart illustrating a process discharge gas pollutedmaterial removal method with a regenerating means of a pollutedoxidation catalyst according to a third exemplary embodiment of thepresent invention illustrated in FIG. 5.

FIG. 7 is a time chart illustrating operation stop of a plasma reactorand an ozone generator according to the flowchart of FIG. 6.

FIG. 8 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a fourth exemplary embodiment of thepresent invention.

FIG. 9 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a fifth exemplary embodiment of thepresent invention.

FIG. 10 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a sixth exemplary embodiment of thepresent invention.

FIG. 11 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a modified example of a seventhexemplary embodiment of the present invention.

FIG. 12 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to an eighth exemplary embodiment of thepresent invention.

FIG. 13 is a cross-sectional view illustrating a plasma reactor appliedto FIG. 12.

FIG. 14 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a ninth exemplary embodiment of thepresent invention.

FIG. 15 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a tenth exemplary embodiment of thepresent invention.

MODE FOR INVENTION

The present invention will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the invention are shown. As those skilled in the art would realize,the described embodiments may be modified in various different ways, allwithout departing from the spirit or scope of the present invention.

Portions unrelated to the description will be omitted in order toobviously describe the present invention, and similar components will bedenoted by the same or similar reference numerals throughout the presentspecification.

In addition, since sizes and thicknesses of the respective componentsillustrated in the drawings are arbitrarily illustrated for convenienceof explanation, the present invention is not necessarily limited tothose illustrated in the drawings.

In addition, throughout the present specification, unless explicitlydescribed to the contrary, the word “comprise” and variations such as“comprises” or “comprising”, will be understood to imply the inclusionof stated elements but not the exclusion of any other elements.

FIG. 1 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a first exemplary embodiment of thepresent invention.

Referring to FIG. 1, a process discharge gas polluted material removaldevice 101 with a regenerating means of a polluted oxidation catalystincludes a pipe 10 circulating a process discharge gas, an oxidationcatalyst tower 20 connected to the pipe 10 and having an oxidationcatalyst 21 embedded therein, and a plasma reactor 40 generating asynthesis gas including hydrogen and having a high temperature.

The process discharge gas is generated and discharged in each process ofindustrial sites, and includes a polluted material such as a combustiblematerial, an organic material, and an inorganic material together withdischarge of NOx in the case in which a high-temperature process isincluded. For example, the combustible material includes CO and HC, andthe inorganic material includes sulfur, a fluorine-based compound. Theprocess discharge gas introduced into the pipe 10 in a productionprocess is maintained at a first temperature level set depending on aprocess.

The oxidation catalyst 21 is embedded in the oxidation catalyst tower20, and with respect to a flow of the process discharge gas, thecombustible material included in the process discharge gas introducedinto the front of the oxidation catalyst 21 is removed by an oxidationcatalyst action, and the process discharge gas is then discharged to therear of the oxidation catalyst 21

The oxidation catalyst 21 is poisoned by the polluted material such asthe organic material and the inorganic material included in the processdischarge gas, such that activity of the oxidation catalyst 21 may bedecreased. In this case, when the synthesis gas including the hydrogenand having the high temperature (for example, 350° C. or more),generated by the plasma reactor 40 and supplied to the front of theoxidation catalyst 21 is supplied to the oxidation catalyst 21, theoxidation catalyst 21 may be regenerated.

That is, the synthesis gas including the hydrogen and having the hightemperature oxidizes and removes the combustible material in theoxidation catalyst 21, the inorganic material is volatilized or combinesand reacts with the hydrogen on a catalyst surface, and the organicmaterial and the inorganic material poisoning the oxidation catalyst 21are thus removed.

After the oxidation catalyst 21 is regenerated, the process dischargegas discharged from the oxidation catalyst tower 20 is discharged to therear while being maintained at a second temperature (for example, 255°C.) level higher than a first temperature (for example, 222° C.).

FIG. 2 is a cross-sectional view illustrating a plasma reactor appliedto FIG. 1.

Referring to FIG. 2, a plasma reactor 40 includes a housing 41electrically grounded and an electrode 42 embedded in the housing 41 andhaving a voltage V applied thereto.

The housing 41 includes a fuel supply port 43 and an air supply port 44disposed at one side thereof, and includes a discharge port 45 disposedat the other side thereof. The fuel supply port 43 and the air supplyport 44 supplies a fuel and an air, respectively, to an electricdischarge gap G, and the discharge port 45 discharges a synthesis gasincluding hydrogen, generated by a plasma reaction.

The electrode 42 may be provided at an inlet side of the housing 41 towhich the fuel and the air are supplied. As an example, the electrode 42is disposed between the fuel supply port 43 and the air supply port 44.Therefore, when the voltage V is applied to the electrode 42 in a statein which the housing 41 is grounded, an arc is generated in the electricdischarge gap G set between the electrode 42 and the housing 41 togenerate a plasma reaction using the supplied fuel and air. In thiscase, the used fuel may be a hydrocarbon-based fuel including hydrogen,such as a liquefied natural gas (LNG).

The housing 41 includes a plasma reaction space S extended from the fuelsupply port 43 and the air supply port 44 to the discharge port 45.Therefore, the arc generated in the electric discharge gap G set betweenthe electrode 42 and the housing 41 generates a synthesis gas includinghydrogen and having a high temperature while being diffused by theplasma reaction in the plasma reaction space S.

The plasma reaction space S expanded and formed in the housing 41facilitates the plasma reaction, and allows the hydrogen and thesynthesis gas having the high temperature to be discharged through thedischarge port 45. The process discharge gas may be generated and becontinuously supplied at a large flow rate through the pipe 10 in anindustrial process.

Since the plasma reactor 40 generates the plasma reaction, which is apartial oxidation reaction, to generate the hydrogen, it may supplyhydrogen to the oxidation catalyst 21 in the shortest time. A byproductof the partial oxidation reaction is discharged in a high temperaturestate from the plasma reaction space S through the discharge port 45.

Therefore, the synthesis gas including hydrogen and having a temperatureof 300 to 600° C. or more may be generated without performing a separateheating process and be then supplied to the oxidation catalyst 21. Thatis, plasma having an arc form may form a relatively high temperaturecondition in the plasma reaction space S within the plasma reactor 40.

The synthesis gas including hydrogen, generated in the plasma reactor 40is supplied to the oxidation catalyst 21 of the oxidation catalyst tower20. At the same time, the process discharge gas introduced into the pipe10 and having the first temperature passes through the oxidationcatalyst 21 and is then discharged.

Therefore, the oxidation catalyst 21 poisoned by the organic materialand the inorganic material included in the process discharge gas isregenerated by exposure to a high temperature condition by the synthesisgas including the hydrogen and having the temperature of 300 to 600° C.or more. That is, the organic material and the inorganic material X ofthe poisoned oxidation catalyst 21 are volatilized at a high temperatureto be thus removed from the catalyst surface or are combined with thehydrogen in a form of HnXm to be thus separated and removed from theoxidation catalyst 21.

After oxidation catalyst 21 is regenerated, the process discharge gasdischarged from the oxidation catalyst tower 20 is heat to the secondtemperature level higher than the first temperature.

FIG. 3 is a cross-sectional view illustrating another plasma reactorapplied to FIG. 1.

Referring to FIG. 3, a plasma reactor 60 may further include a reformingcatalyst 61. That is, the reforming catalyst 61 communicates with aplasma reaction space S formed between a fuel supply port 43 and an airsupply port 44, and a discharge port 45 of a housing 641.

In the case of using the reforming catalyst 61, a reforming reaction dueto a catalyst may be additional caused to decrease electric powerrequired for a plasma reaction. Therefore, energy applied as a voltage Vto an electrode 42 in order to generate the hydrogen may be decreased,and a processing capacity for oxidizing and removing the pollutedmaterial included in the process discharge gas may be increased.

The plasma reactor 60 may further include a fuel additional supply port643 and an air additional supply port 644 provided between the plasmareaction space S of the housing 641 and the reforming catalyst 61 toreceive an additionally supplied fuel and air, thereby further extendingplasma generated and discharged by the plasma reaction space S.

The further extended plasma may be supplied to the reforming catalyst 61to further activate the reforming reaction of the reforming catalyst,thereby maximizing a reforming action of the reforming catalyst 61. Thatis, since the plasma reaction space S and the reforming catalyst 61further facilitates the plasma reaction and large amounts of hydrogenand synthesis gas having a high temperature are discharged through adischarge port 45, the plasma reactor may be effectively applied to alarge flow rate industrial process.

FIG. 4 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a second exemplary embodiment of thepresent invention.

Referring to FIG. 4, a first control valve V1 of a process discharge gaspolluted material removal device 102 with a regenerating means of apolluted oxidation catalyst is installed on a pipe 10 and selects a pathof a process discharge gas introduced into the pipe 10 and supplied toan oxidation catalyst tower 20 in an industrial process, and having afirst temperature.

That is, the first valve V1 is controlled so that the process dischargegas having the first temperature is supplied to an oxidation catalyst 21or bypasses the oxidation catalyst 21. The first control valve V1 mayallow the process discharge gas to bypass the oxidation catalyst 21 atthe time of regenerating the oxidation catalyst 21.

To this end, the process discharge gas polluted material removal device102 with a regenerating means of a polluted oxidation catalyst isprovided with a bypass pipe 50. The bypass pipe 50 is connected to thepipe 10 in front of the oxidation catalyst 21 so that the processdischarge gas bypasses the oxidation catalyst 21, and is connected tothe oxidation catalyst tower 20 behind the oxidation catalyst 21. Thefirst control valve V1 is installed on a connected portion between thepipe 10 and the bypass pipe 50, and selects a flow of the processdischarge gas having the first temperature to the front or the rear ofthe oxidation catalyst 21.

A plasma reactor 40 is connected to the oxidation catalyst tower 20behind the first valve V1 and in front of the oxidation catalyst 21.Therefore, when the first control valve V1 is controlled to allow theprocess discharge gas to be bypassed to the bypass pipe 50, the plasmareactor 40 generates a synthesis gas including hydrogen by a plasmareaction and supplies the synthesis gas including the hydrogen to theoxidation catalyst 21.

In this case, the bypass pipe 50 and the first control valve V1 allowsthe process discharge gas introduced into the pipe 10 and having thefirst temperature to be discharged without passing through the oxidationcatalyst 21.

In the case in which a flow rate of the process discharge gas is large,the first control valve V1 is periodically switched to selectivelyconnect the pipe 10 to the front and the rear of the oxidation catalyst21. In addition, the plasma reactor 40 is periodically driven toperiodically supply hydrogen and a synthesis gas including hydrogen tothe oxidation catalyst 21. Therefore, the poisoned oxidation catalyst 21may be periodically regenerated.

FIG. 5 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a third exemplary embodiment of thepresent invention.

Referring to FIG. 5, a process discharge gas polluted material removaldevice 103 with a regenerating means of a polluted oxidation catalystincludes an ozone generator 90 supplying ozone to the front of theoxidation catalyst 21. Hereinafter, a description for the samecomponents is omitted, and characteristic features are described.

The ozone generator 90 is connected to the oxidation catalyst tower 20,and supplies generated ozone to the front of the oxidation catalyst 21.The plasma reactor 40 and the ozone generator 90 may be driven indifferent times, respectively, to generate hydrogen and ozone,respectively, and supply the generated hydrogen and ozone to theoxidation catalyst 21.

The ozone generator 90 is configured to generate ozone from air oroxygen supplied to one side thereof. Ozone may oxidize and remove theorganic material from the poisoned oxidation catalyst 21.

FIG. 6 is a flowchart illustrating a process discharge gas pollutedmaterial removal method with a regenerating means of a pollutedoxidation catalyst according to a third exemplary embodiment of thepresent invention illustrated in FIG. 5, and FIG. 7 is a time chartillustrating operation stop of a plasma reactor and an ozone generatoraccording to the flowchart of FIG. 6.

Referring to FIGS. 6 and 5, a process discharge gas polluted materialremoval method with a regenerating means of a polluted oxidationcatalyst includes a first step ST1, a second step ST2, a third step ST3,a fourth step ST4 and a fifth step ST5. Hereinafter, a process dischargegas polluted material removal method will be described with reference toa third exemplary embodiment.

In the first step ST1, in order to regenerate the poisoned oxidationcatalyst 21, the process discharge gas is blocked to bypass theoxidation catalyst 21. In this case, the process discharge gas bypassesthe oxidation catalyst 21 through the pipe 10, the first control valveV1 and the bypass pipe 50, and is then discharged to the oxidationcatalyst tower 20.

In the second step ST2, when a predetermined time elapses after theprocess discharge gas is blocked, hydrogen generated by driving theplasma reactor 40 is supplied to the oxidation catalyst 21 to remove theinorganic material of the poisoned oxidation catalyst 21.

The hydrogen and the synthesis gas generated in a state in which theprocess discharge gas is blocked are supplied to the oxidation catalyst21 to remove the inorganic material, thereby regenerating the oxidationcatalyst 21.

When a high temperature condition is formed in order to regenerate theoxidation catalyst 21 poisoned by the inorganic material in a conditionin which a temperature of the process discharge gas is lower than a setvalue (350° C.), excessive energy may be consumed in order to increasethe temperature of the process discharge gas.

In the present exemplary embodiment, the process discharge gas isbypassed to the bypass pipe 50, and the hydrogen and the synthesis gasare supplied to the oxidation catalyst 21. Therefore, the temperature ofthe process discharge gas may be increased by very small flow rates ofhydrogen and synthesis gas and energy to regenerate the oxidationcatalyst 21. That is, the plasma reactor 40 supplies a hydrogenreforming gas having a high temperature to the oxidation catalyst 21.

In the third step ST3, when a predetermined time elapses after theplasma reactor 40 is driven, an operation of the plasma reactor 40 isstopped to block the supply of the hydrogen.

In the fourth step ST4, when a predetermined time elapses after thesupply of the hydrogen is blocked, the ozone generated by driving theozone generator 90 is supplied to the poisoned oxidation catalyst 21 toremove the organic material of the poisoned oxidation catalyst 21. Inthis case, the process discharge gas is cooled to a temperature lowerthan that when the plasma reactor 40 is operated to supply the hydrogen.The ozone generated in a state in which the hydrogen and the synthesisgas are blocked is supplied to the oxidation catalyst 21 to oxidize andremove the organic material, thereby regenerating the oxidation catalyst21.

In the fifth step ST5, when a predetermined time elapses after the ozonegenerator 90 is driven, an operation of the ozone generator 90 isstopped to block the supply of the ozone, and the bypass for theoxidation catalyst 21 is released to introduce the process discharge gasinto the oxidation catalyst 21 (ST51). When the supply of the ozone isblocked and the process discharge gas is supplied to the oxidationcatalyst 21, the oxidation catalyst 21 removes the polluted materialsuch as CO, the organic material, and the inorganic material included inthe process discharge gas.

FIG. 8 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a fourth exemplary embodiment of thepresent invention.

Referring to FIG. 8, a process discharge gas polluted material removaldevice 104 with a regenerating means of a polluted oxidation catalystfurther includes a reduction catalyst tower 30 connected to theoxidation catalyst tower 20 and having a selective catalytic reduction(SCR) 31 embedded therein.

After the oxidation catalyst 21 is regenerated, the process dischargegas discharged from the oxidation catalyst tower 20 is maintained at asecond temperature (for example, 255° C.) level higher than a firsttemperature (for example, 222° C.). Therefore, the selective catalyticreduction 31 may have a temperature increased up to a startuptemperature by the process discharge gas heated and supplied and havingthe second temperature after the oxidation catalyst 21 is regenerated.

The selective catalytic reduction 31 is embedded in the reductioncatalyst tower 30, has the temperature increased up to the startuptemperature by the process discharge gas introduced into the front ofthe selective catalytic reduction 31 and having the second temperature,and reduces and removes NOx included in the process discharge gas havingthe second temperature level.

Therefore, the selective catalytic reduction 31 may effectively removeNOx included in the process discharge gas having the second temperaturewithout using a separate heating means.

The selective catalytic reduction 31 has the temperature increased up tothe startup temperature by the process discharge gas introduced into thefront thereof and having the second temperature, and effectively reducesand removes NOx included in the process discharge gas without using theseparate heating means.

For example, the process discharge gas polluted material removal device104 with a regenerating means of a polluted oxidation catalyst mayenable a temperature increase of about 9° C. in the process dischargegas per 1000 ppm of CO through an oxidation reaction in the oxidationcatalyst 21. Even in the case in which a flow rate of the processdischarge gas is large, the process discharge gas polluted materialremoval device 104 with a regenerating means of a polluted oxidationcatalyst does not heat the entirety of the process discharge gas, butheats a portion of the process discharge gas, and thus, does not requirea large amount of energy and a large equipment such as a large burner.

FIG. 9 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a fifth exemplary embodiment of thepresent invention.

Referring to FIG. 9, a process discharge gas polluted material removaldevice 105 with a regenerating means of a polluted oxidation catalystfurther includes a first control valve V1 and a bypass pipe 50.

The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst includes a pipe 10circulating a process discharge gas, an oxidation catalyst tower 20connected to the pipe 10 and having an oxidation catalyst 21 embeddedtherein, a reduction catalyst tower 30 connected to the oxidationcatalyst tower 20 and having a selective catalytic reduction (SCR)embedded therein, a first control valve V1 selecting a path of theprocess discharge gas, and a plasma reactor 40 generating a synthesisgas including hydrogen and having a high temperature.

The process discharge gas introduced into the pipe 10 in a productionprocess is maintained at a first temperature level set depending on aprocess. After a combustible material included in the process dischargegas introduced into the front of the oxidation catalyst 21 is removedthrough an oxidation catalyst action, the process discharge gas isdischarged to the rear of the oxidation catalyst 21.

When the synthesis gas including the hydrogen and having the hightemperature (for example, 350° C. or more), generated by the plasmareactor 40 and supplied to the front of the oxidation catalyst 21 issupplied to the oxidation catalyst 21, the oxidation catalyst 21 may beregenerated.

That is, the synthesis gas including the hydrogen and having the hightemperature oxidizes and removes the combustible material in theoxidation catalyst 21, the inorganic material is volatilized or combinesand reacts with the hydrogen on a catalyst surface, and the organicmaterial and the inorganic material poisoning the oxidation catalyst 21are thus removed.

After the oxidation catalyst 21 is regenerated, the process dischargegas discharged from the oxidation catalyst tower 20 is maintained at asecond temperature (for example, 255° C.) level higher than a firsttemperature (for example, 222° C.). Therefore, the selective catalyticreduction 31 may have a temperature increased up to a startuptemperature by the process discharge gas heated and supplied and havingthe second temperature after the oxidation catalyst 21 is regenerated.

The selective catalytic reduction 31 is embedded in the reductioncatalyst tower 30, has the temperature increased up to the startuptemperature by the process discharge gas introduced into the front ofthe selective catalytic reduction 31 and having the second temperature,and reduces and removes NOx included in the process discharge gas havingthe second temperature level. Therefore, the selective catalyticreduction 31 may effectively remove NOx included in the processdischarge gas having the second temperature without using a separateheating means.

The first control valve V1 is installed on the pipe 10, and selects thepath of the process discharge gas introduced into the pipe 10 andsupplied to the oxidation catalyst tower 20 in an industrial process,and having a first temperature. That is, the first valve V1 iscontrolled so that the process discharge gas having the firsttemperature is supplied to the oxidation catalyst 21 or bypasses theoxidation catalyst 21. The first control valve V1 may allow the processdischarge gas to bypass the oxidation catalyst 21 at the time ofregenerating the oxidation catalyst 21.

The bypass pipe 50 is connected to the pipe 10 in front of the oxidationcatalyst 21 so that the process discharge gas bypasses the oxidationcatalyst 21, and is connected to the oxidation catalyst tower 20 behindthe oxidation catalyst 21. The first control valve V1 is installed on aconnected portion between the pipe 10 and the bypass pipe 50, andselects a flow of the process discharge gas having the first temperatureto the front or the rear of the oxidation catalyst 21.

The plasma reactor 40 is connected to the oxidation catalyst tower 20behind the first valve V1 and in front of the oxidation catalyst 21.Therefore, when the first control valve V1 is controlled to allow theprocess discharge gas to be bypassed to the bypass pipe 50, the plasmareactor 40 generates a synthesis gas including hydrogen by a plasmareaction and supplies the synthesis gas including the hydrogen to theoxidation catalyst 21.

Therefore, the oxidation catalyst 21 poisoned by the organic materialand the inorganic material included in the process discharge gas isregenerated by exposure to a high temperature condition by the synthesisgas including the hydrogen and having the temperature of 300 to 600° C.or more. That is, the organic material and the inorganic material X ofthe poisoned oxidation catalyst 21 are volatilized at a high temperatureto be thus removed from the catalyst surface or are combined with thehydrogen in a form of HnXm to be thus separated and removed from theoxidation catalyst 21.

In the case in which a flow rate of the process discharge gas is large,the first control valve V1 is periodically switched to selectivelyconnect the pipe 10 to the front and the rear of the oxidation catalyst21. In addition, the plasma reactor 40 is periodically driven toperiodically supply hydrogen and a synthesis gas including hydrogen tothe oxidation catalyst 21. Therefore, the poisoned oxidation catalyst 21may be periodically regenerated.

After the oxidation catalyst 21 is regenerated, the process dischargegas discharged from the oxidation catalyst tower 20 is heated to thesecond temperature level higher than the first temperature and is thensupplied to the selective catalytic reduction 31 to increase thetemperature of the selective catalytic reduction 31 to the startuptemperature.

The selective catalytic reduction 31 has the temperature increased up tothe startup temperature by the process discharge gas introduced into thefront thereof and having the second temperature, and effectively reducesand removes NOx included in the process discharge gas without using theseparate heating means.

For example, the process discharge gas polluted material removal device105 with a regenerating means of a polluted oxidation catalyst mayenable a temperature increase of about 9° C. in the process dischargegas per 1000 ppm of CO through an oxidation reaction in the oxidationcatalyst 21. Even in the case in which a flow rate of the processdischarge gas is large, the process discharge gas polluted materialremoval device 105 with a regenerating means of a polluted oxidationcatalyst does not heat the entirety of the process discharge gas, butheats a portion of the process discharge gas, and thus, does not requirea large amount of energy and a large equipment such as a large burner.

FIG. 10 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a sixth exemplary embodiment of thepresent invention.

Referring to FIG. 10, a process discharge gas polluted material removaldevice 106 with a regenerating means of a polluted oxidation catalystincludes a pipe 10, a first oxidation catalyst tower 221 and a secondoxidation catalyst tower 222 connected to the pipe 10 through a firstcontrol valve V21, a plasma reactor 40, and an ozone generator 90.

The first oxidation catalyst tower 221 has a first oxidation catalyst221 embedded therein, and the second oxidation catalyst tower 222 has asecond oxidation catalyst 212 embedded therein. The first and secondoxidation catalysts 211 and 212 may be formed and disposed in one stageor plural stages within the first and second oxidation catalyst towers221 and 222, respectively.

Since the first and second oxidation catalyst towers 221 and 222 areconnected to the pipe 10 through the first control valve V21, they mayreceive a process discharge gas selectively supplied depending on anoperation of the first control valve V21. That is, the first controlvalve V21 provided in the pipe 10 selects whether to supply the processdischarge gas to the first oxidation catalyst tower 221 or the secondoxidation catalyst tower 222.

The plasma reactor 40 and the ozone generator 90 may be connected to thefirst and second oxidation catalyst towers 221 and 222 to selectivelyhydrogen and ozone to the fronts of the first and second oxidationcatalysts 211 and 212. To this end, a supply pipe 450 is connected tothe first and second oxidation catalyst towers 221 and 222, and isconnected to the plasma reactor 40 and the ozone generator 90 toselectively supply the hydrogen, a synthesis gas, and the ozone.

A third control valve V23 is interposed in the supply pipe 450 and isconnected to the plasma reactor 40, and a fourth control valve V24 isinterposed in the supply pipe 450 and is connected to the ozonegenerator 90.

That is, the plasma reactor 40 is selectively connected to the first andsecond catalyst towers 221 and 222 through the third control valve V23and the supply pipe 450, and the ozone generator 90 is selectivelyconnected to the first and second catalyst towers 221 and 222 throughthe fourth control valve V24.

For example, in the case in which the second oxidation catalyst 212 ispoisoned, the first control valve V21 supplies the process discharge gasto the first oxidation catalyst tower 221 to allow the process dischargegas to bypass the second oxidation catalyst 212, and the third controlvalve V23 supplies the hydrogen and the synthesis gas to the secondoxidation catalyst tower 222 through the supply pipe 450 to remove aninorganic material from the poisoned second oxidation catalyst 212,thereby regenerating the second oxidation catalyst 212. In this case, apolluted material included in the process discharge gas is removed inthe first oxidation catalyst 211 of the first oxidation catalyst tower221.

In addition, after the inorganic material is removed from the poisonedsecond oxidation catalyst 212 in a higher temperature condition, drivingof the plasma reactor 40 is stopped, and the ozone generator 90 isdriven at a temperature lower than a temperature at which the inorganicmaterial is removed.

In this state, a large amount of ozone generated by the ozone generator90 is supplied to the second oxidation catalyst 212 within the secondoxidation catalyst tower 222, such that an organic material is oxidizedand removed by the ozone from the poisoned second oxidation catalyst212.

That is, the plasma reactor 40 and the ozone generator 90 areperiodically driven with respect to the second oxidation catalyst 212 toperiodically supply the hydrogen and the ozone to the second oxidationcatalyst 212, respectively. Therefore, the second oxidation catalyst 212may be periodically regenerated from the inorganic material and theorganic material when the polluted material is not removed.

In addition, in the case in which the second oxidation catalyst 211 ispoisoned, the first control valve V21 supplies the process discharge gasto the second oxidation catalyst tower 222 to allow the processdischarge gas to bypass the first oxidation catalyst 211, and the thirdcontrol valve V23 supplies the hydrogen and the synthesis gas to thefirst oxidation catalyst tower 221 to remove an inorganic material fromthe poisoned first oxidation catalyst 211, thereby regenerating thefirst oxidation catalyst 211. In this case, a polluted material includedin the process discharge gas is removed in the second oxidation catalyst212 of the second oxidation catalyst tower 222.

In addition, after the inorganic material is removed from the poisonedfirst oxidation catalyst 211 in a higher temperature condition, drivingof the plasma reactor 40 is stopped, and the ozone generator 90 isdriven at a temperature lower than a temperature at which the inorganicmaterial is removed.

In this state, a large amount of ozone generated by the ozone generator90 is supplied to the first oxidation catalyst 211 within the firstoxidation catalyst tower 221, such that an organic material is oxidizedand removed by the ozone from the poisoned first oxidation catalyst 211.

That is, the plasma reactor 40 and the ozone generator 90 areperiodically driven with respect to the first oxidation catalyst 211 toperiodically supply the hydrogen and the ozone to the first oxidationcatalyst 211, respectively. Therefore, the first oxidation catalyst 211may be periodically regenerated from the inorganic material and theorganic material when the polluted material is not removed.

Therefore, the process discharge gas may be continuously oxidized andremoved through the first or second oxidation catalyst 211 or 212 of thefirst or second oxidation catalyst tower 221 or 222 while the second orfirst oxidation catalyst 212 or 211 being regenerated.

FIG. 11 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a modified example of a seventhexemplary embodiment of the present invention.

Referring to FIG. 11, in a process discharge gas polluted materialremoval device 107 with a regenerating means of a polluted oxidationcatalyst, an oxidation catalyst tower 220 includes a first oxidationcatalyst tower 221 and a second oxidation catalyst tower 222. The firstoxidation catalyst tower 221 and the second oxidation catalyst tower 222may be disposed in parallel with each other, and may be selectivelyconnected to a selective catalytic reduction 31 by a second controlvalve V22.

A first control valve V21 is disposed in front of the first and secondoxidation catalysts 211 and 212, and selectively connect a pipe 10 tothe first and second oxidation catalyst towers 221 and 222. Therefore,the process discharge gas passing through the pipe 10 and having a firsttemperature may be selectively supplied to the first and secondoxidation catalysts 211 and 212 of the first and second oxidationcatalyst towers 221 and 222 depending on a control of the first controlvalve V21.

The second control valve V22 is disposed behind the first and secondoxidation catalysts 211 and 212, and selectively connects the first andsecond oxidation catalyst towers 221 and 222 to the selective catalyticreduction 31. Therefore, the process discharge gas passing through thefirst and second oxidation catalysts 211 and 212 of the first and secondoxidation catalyst towers 221 and 222 and having a second temperaturemay be selectively supplied to the selective catalytic reduction 31depending on a control of the second control valve V22.

A plasma reactor 40 is selectively connected to the first and secondoxidation catalyst towers 221 and 222 through the selective catalyticreduction 31 behind the first control valve V21 and in front of thefirst and second oxidation catalysts 211 and 212. Therefore, a synthesisgas including hydrogen and having a high temperature, generated by theplasma reactor 40 may be selectively supplied to the first and secondoxidation catalysts 211 and 212 of the first and second oxidationcatalyst towers 221 and 222 depending on a control of a third controlvalve V23.

For example, in the case in which the second oxidation catalyst 212 ispoisoned, the second oxidation catalyst 212 is regenerated, and thefirst oxidation catalyst 211 performs an oxidation catalyst action toincrease a temperature of the process discharge gas while oxidizing andremoving a combustible material. In this case, the selective catalyticreduction 31 removes NOx by a selective catalytic reduction reaction atthe increased temperature.

That is, the first control valve V21 selectively connects the pipe 10 tothe first oxidation catalyst tower 221, such that the process dischargegas having the first temperature is supplied to the first oxidationcatalyst tower 221 and is oxidized in the first oxidation catalyst 211.The second control valve V22 connects the first oxidation catalyst tower221 to a reduction catalyst tower 30, such that the process dischargegas supplied at the second temperature is supplied to the reductioncatalyst tower 30 and is reduced in the selective catalytic reduction31.

In addition, the third control valve V23 selectively connects the plasmareactor 40 to the poisoned second oxidation catalyst 212, such that thesynthesis gas including the hydrogen is supplied to the second oxidationcatalyst 212 to remove an organic material and an inorganic materialpoisoning the second oxidation catalyst 212.

In addition, in the case in which the first oxidation catalyst 211 ispoisoned, the first oxidation catalyst 211 is regenerated, and thesecond oxidation catalyst 212 performs an oxidation catalyst action toincrease a temperature of the process discharge gas while oxidizing andremoving a combustible material. In this case, the selective catalyticreduction 31 removes NOx by a selective catalytic reduction reaction atthe increased temperature.

That is, the first control valve V21 selectively connects the pipe 10 tothe second oxidation catalyst tower 222, such that the process dischargegas having the first temperature is supplied to the second oxidationcatalyst tower 222 and is oxidized in the second oxidation catalyst 212.The second control valve V22 connects the second oxidation catalysttower 222 to the reduction catalyst tower 30, such that the processdischarge gas supplied at the second temperature is supplied to thereduction catalyst tower 30 and is reduced in the selective catalyticreduction 31.

In addition, the third control valve V23 selectively connects the plasmareactor 40 to the poisoned first oxidation catalyst 211, such that thesynthesis gas including the hydrogen is supplied to the first oxidationcatalyst 211 to remove an organic material and an inorganic materialpoisoning the first oxidation catalyst 211.

Therefore, the process discharge gas polluted material removal device107 with a regenerating means of a polluted oxidation catalyst maycontinuously remove the combustible material included in the processdischarge gas having the first temperature through the first or secondoxidation catalyst 211 or 212 of the first or second oxidation catalysttower 221 or 222 while regenerating the second or first oxidationcatalyst 212 or 211, and may remove NOx through the selective catalyticreduction 31 at a high temperature generated at the time of removing thecombustible material.

In addition, after the first or second oxidation catalyst 211 or 212 isselectively regenerated, the process discharge gas discharged to thefirst and second oxidation catalyst towers 221 and 222 and having asecond temperature level is supplied to the selective catalyticreduction 31 to increase a temperature of selective catalytic reduction31 up to a startup temperature.

Therefore, the selective catalytic reduction 31 has the temperaturesufficiently increased up to the startup temperature by the processdischarge gas introduced into the front thereof and having the secondtemperature, and may effectively and sufficiently reduce and remove NOxincluded in the process discharge gas without using a separate heatingmeans.

Even in the case in which a flow rate of the process discharge gas islarge, the process discharge gas having the first temperature is notentirely heated, such that a large amount of energy and a largeequipment such as a large burner are not required, and the processdischarge gas is not discharged in a bypass manner.

FIG. 12 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to an eighth exemplary embodiment of thepresent invention, and FIG. 13 is a cross-sectional view illustrating aplasma reactor applied to FIG. 12.

Referring to FIGS. 12 and 13, in a process discharge gas pollutedmaterial removal device 108 with a regenerating means of a pollutedoxidation catalyst, an oxidation catalyst tower 320 is connected to apipe 10, and a reduction catalyst tower 30 is provided behind andconnected to the oxidation catalyst tower 320. A first control valve V31is provided in front of the oxidation catalyst tower 320, and a secondcontrol valve V32 is provide behind the oxidation catalyst tower 320.

The first control valve V31 intermits a process discharge gas suppliedfrom a pipe 10 to the oxidation catalyst tower 320 and having a firsttemperature, and the second control valve V32 intermits a processdischarge gas supplied from the oxidation catalyst tower 320 to thereduction catalyst tower 30 and having a second temperature.

A bypass pipe 350 is connected to the pipe 10 through the first controlvalve V31 in front of an oxidation catalyst 321 and is connected to theoxidation catalyst tower 320 through the second control valve V32 behindthe oxidation catalyst 321 so that the process discharge gas bypassesthe oxidation catalyst tower 320. A plasma reactor 340 is installed onthe bypass pipe 350.

Therefore, depending on selection controls of the first and secondcontrol valves V31 and V2, introduction and discharge of the processdischarge gas are temporarily blocked at the first and second controlvalves V31 and V32, and the oxidation catalyst 321 and the plasmareactor 340 form a closed loop through the bypass pipe 350 and the firstand second control valves V31 and V32. That is, the plasma reactor 340generates a plasma reaction by process discharge gas circulated throughthe closed loop and having the first temperature and separately suppliedair to generate and circulate a synthesis gas including hydrogen.

Since the plasma reactor 340 is driven by receiving the processdischarge gas gradually heated from the first temperature to a hightemperature rather than receiving separate fresh air, a fuel forincreasing the temperature of the process discharge gas may bedecreased. However, when the plasma reactor 340 is operated in theclosed loop, it continuously receives and uses a gas combusted inadvance, and a concentration of oxygen is thus gradually decreased.

Therefore, in the case in which the plasma reactor is operated in theclosed loop using a general burner, an operable range becomes verynarrow. However, even in the case in which the plasma reactor 340 isoperated in the closed loop, a frame may be maintained even when aconcentration of oxygen in the gas introduced into the plasma reactor340 is about 10 to 100% of a combustion equivalent ratio.

Therefore, since the plasma reactor 340 is operated to sufficientlygenerate the synthesis gas including the hydrogen and supplies thesynthesis gas including the hydrogen to the oxidation catalyst 321 tocirculate the synthesis gas including the hydrogen, a combustiblematerial may be removed by an oxidation catalyst action in the oxidationcatalyst 321, catalyst poisoning occurring on the oxidation catalyst 321may be solved, and NOx may be sufficiently removed in the selectivecatalytic reduction 31.

To this end, a process discharge gas supply port 343 provided at oneside of a housing 341 in the plasma reactor 340 is connected to thebypass pipe 350 to supply the process discharge gas passing through thesecond control valve V32 and gradually heated from the first temperatureto the high temperature into the housing 341.

The housing 341 that is grounded and an electrode 342 to which a voltageis applied generate an arc therebetween, and generate a plasma reactionin a plasma reaction space S, by partially using the circulated processdischarge gas and air (fresh air) supplied to an air supply port 344.

Therefore, a discharge port 345 provided at the other side of thehousing 341 discharges a synthesis gas including hydrogen, generated bythe plasma reaction in the plasma reaction space S, to the bypass pipe350 to allow the synthesis gas including the hydrogen to pass throughthe first control valve V31 and be then supplied again to the oxidationcatalyst 321.

The process discharge gas polluted material removal device 108 with aregenerating means of a polluted oxidation catalyst may remove NOxincluded in the process discharge gas continuously further heated fromthe first temperature through the oxidation catalyst 321 of theoxidation catalyst tower 320 by a selective reduction reaction in theselective catalytic reduction 31 while regenerating the oxidationcatalyst 321 poisoned by an organic material and an inorganic material.

In addition, after the oxidation catalyst 321 is regenerated, the bypasspipe 350 is blocked, and the process discharge gas discharged from theoxidation catalyst tower 320 and having a second temperature is suppliedto the selective catalytic reduction 31 to increase a temperature of theselective catalytic reduction 31 up to a startup temperature, bycontrols of the first and second control valves V31 and V32.

Therefore, the selective catalytic reduction 31 has the temperaturesufficiently increased up to the startup temperature by the processdischarge gas introduced into the front thereof and having the secondtemperature, and may effectively and sufficiently reduce and remove NOxincluded in the process discharge gas having the second temperaturewithout using a separate heating means.

FIG. 14 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a ninth exemplary embodiment of thepresent invention.

Referring to FIG. 14, in a process discharge gas polluted materialremoval device 109 with a regenerating means of a polluted oxidationcatalyst, a reduction catalyst tower 70 having a selective catalyticreduction 71 embedded therein is provided in front of an oxidationcatalyst tower 320, and is connected to a pipe 10.

A heat exchanger 80 is installed on a rear pipe 11 connected to the rearof the oxidation catalyst tower 320 and the pipe 10 connected to thefront of the reduction catalyst tower 70. The heat exchanger 80transfers heat of a process discharge gas heated in the oxidationcatalyst tower 320 to have a second temperature to the pipe 10 toincrease a temperature of a process discharge gas supplied to the pipe10 and having a first temperature to a second temperature level.

A first control valve V31 intermits a process discharge gas suppliedfrom the reduction catalyst tower 70 to the oxidation catalyst tower 320through the pipe 10 and having the first temperature, and the rear pipe11 supplies the process discharge gas having the second temperature fromthe oxidation catalyst tower 320 to the heat exchanger 80.

An oxidation catalyst 321 is connected to a plasma reactor 40 or thereduction catalyst tower 70 depending on a selection control of thefirst control valve V31. That is, the plasma reactor 40 generates aplasma reaction by a fuel and air to generate a synthesis gas includinghydrogen, and supplies the synthesis gas including the hydrogen.

Since the synthesis gas including the hydrogen is sufficiently generatedand passes through the oxidation catalyst 321, the oxidation catalyst321 removes a combustible material by an oxidation catalyst action, andheats the process discharge gas to the second temperature level so as tosufficiently remove NOx from a selective catalytic reduction 31 whilebeing regenerated.

The heated process discharge gas including the synthesis gas isdischarged from the oxidation catalyst tower 320 to the rear pipe 11,and is heat-transferred to the pipe 10 through the heat exchanger 80.The process discharge gas supplied to the pipe 10 and having the firsttemperature has a temperature increased to the second temperature levelby heat transferred from the heat exchanger 80.

The process discharge gas having the temperature increased to the secondtemperature level is supplied to the selective catalytic reduction 31 toincrease a temperature of the selective catalytic reduction 31 to astartup temperature. Therefore, the selective catalytic reduction 31 mayeffectively and sufficiently reduce and remove NOx included in theprocess discharge gas having the second temperature without using aseparate heating means.

FIG. 15 is a configuration diagram illustrating a process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst according to a tenth exemplary embodiment of thepresent invention.

Referring to FIG. 15, in a process discharge gas polluted materialremoval device 110 with a regenerating means of a polluted oxidationcatalyst, a first control valve V31 intermits a process discharge gassupplied from a reduction catalyst tower 70 to an oxidation catalysttower 320 through a pipe 10 and having a first temperature, and a secondcontrol valve V32 intermits a process discharge gas supplied from theoxidation catalyst tower 320 to a rear pipe 11 and a heat exchanger 80and having a second temperature.

An oxidation catalyst 321 and a plasma reactor 340 form a closed loopthrough a bypass pipe 350 depending on selection controls of the firstand second control valves V31 and V32. That is, the plasma reactor 340generates a plasma reaction by the process discharge gas circulatedthrough the closed loop and having the first temperature and separatelysupplied air to generate and circulate a synthesis gas includinghydrogen.

Since the synthesis gas including the hydrogen is sufficiently generatedand is circulated through the oxidation catalyst 321, the oxidationcatalyst 321 more rapidly removes a combustible material by an oxidationcatalyst action, and heats the process discharge gas to a secondtemperature level so as to sufficiently remove NOx from a selectivecatalytic reduction 31 while being regenerated.

The heated process discharge gas including the synthesis gas isdischarged from the oxidation catalyst tower 320 to the rear pipe 11,and is heat-transferred to the pipe 10 through the heat exchanger 80.The process discharge gas supplied to the pipe 10 and having the firsttemperature has a temperature increased to the second temperature levelby heat transferred from the heat exchanger 80.

The process discharge gas having the temperature increased to the secondtemperature level is supplied to the selective catalytic reduction 31 tomore rapidly increase a temperature of the selective catalytic reduction31 to a startup temperature. Therefore, the selective catalyticreduction 31 may effectively and sufficiently reduce and remove NOxincluded in the process discharge gas having the second temperaturewithout using a separate heating means.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

<Description of symbols> 101, 102, 103, 104, 105, 106, 107, 108, 109,110: process discharge gas polluted material removal device withregenerating means of polluted oxidation catalyst 10, 11: pipe 20, 220,320: oxidation catalyst tower 21, 321: oxidation catalyst 30, 70:reduction catalyst tower 31, 71: selective catalytic reduction 40, 60,340: plasma reactor 41, 341, 641: housing 42, 342: electrode 43: fuelsupply port 44, 344: air supply port 45: discharge port 50, 350: bypasspipe 80: heat exchanger 211, 212: first, second oxidation catalyst 221,222: first, second oxidation catalyst tower 343: process discharge gassupply port 643: fuel additional supply port 644: air additional supplyport 90: ozone generator 61: reforming catalyst G: electric dischargegap S: plasma reaction space V: voltage V1, V21, V31: first controlvalve V22, V32: second control valve V23: third control valve V24:fourth control valve

The invention claimed is:
 1. A process discharge gas polluted materialremoval device with a regenerating means of a polluted oxidationcatalyst, comprising: an oxidation catalyst tower connected to a pipecirculating a process discharge gas including a combustible material, anorganic material, an inorganic material X, and nitrogen oxide and havinga first temperature and having an oxidation catalyst embedded therein,the oxidation catalyst oxidizing and removing the combustible material;and a plasma reactor connected to the oxidation catalyst tower at afront of the oxidation catalyst, generating a synthesis gas includinghydrogen and having a high temperature of 300° C. or more by a plasmareaction, and supplying the synthesis gas including the hydrogen to theoxidation catalyst to regenerate the oxidation catalyst poisoned by theorganic material and the inorganic material X, wherein the inorganicmaterial X includes sulfur and a fluorine-based compound, wherein theinorganic material X of the poisoned oxidation catalyst is combined withthe hydrogen in a form of HnXm to be separated and removed from thepoisoned oxidation catalyst, wherein the plasma reactor includes: ahousing including a fuel supply port and an air supply port disposed atone side thereof, including a discharge port disposed at the other sidethereof, and grounded, the discharge port discharging the synthesis gasincluding the hydrogen; and an electrode provided between the fuelsupply port and the air supply port and having a voltage appliedthereto, wherein the housing includes a plasma reaction space extendedbetween a front of the electrode and the discharge port.
 2. The processdischarge gas polluted material removal device with a regenerating meansof a polluted oxidation catalyst of claim 1, further comprising: areduction catalyst tower connected to the oxidation catalyst tower andhaving a selective catalytic reduction embedded therein, the selectivecatalytic reduction removing the nitrogen oxide included in a processdischarge gas having a second temperature higher than the firsttemperature.
 3. The process discharge gas polluted material removaldevice with a regenerating means of a polluted oxidation catalyst ofclaim 2, further comprising: a first control valve performing aselection so as to allow the process discharge gas having the firsttemperature to be supplied from the pipe to the oxidation catalyst orallow the process discharge gas having the first temperature to bypassthe oxidation catalyst and be supplied to the reduction catalyst tower.4. The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst of claim 2 or claim3, wherein: the selective catalytic reduction is heated to a startuptemperature by the process discharge gas passing through the oxidationcatalyst and having the second temperature.
 5. The process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst of claim 1, wherein: the plasma reactor furtherincludes a reforming catalyst communicating with a plasma reaction spaceformed between the fuel supply port and the air supply port, and thedischarge port of the housing.
 6. The process discharge gas pollutedmaterial removal device with a regenerating means of a pollutedoxidation catalyst of claim 5, wherein: the plasma reactor includes afuel additional supply port and an air additional supply port providedbetween the plasma reaction space of the housing and the reformingcatalyst to additionally supply a fuel and air.
 7. The process dischargegas polluted material removal device with a regenerating means of apolluted oxidation catalyst of claim 3, further comprising: a bypasspipe connecting the first control valve to the oxidation catalyst towerso that the process discharge gas bypasses the oxidation catalyst. 8.The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst of claim 3, wherein:the oxidation catalyst tower includes a first oxidation catalyst towerand a second oxidation catalyst tower disposed in parallel with eachother and selectively connected to the selective catalytic reduction bya second control valve, and the first control valve selectively connectsthe pipe to the first oxidation catalyst tower and the second oxidationcatalyst tower in front of the oxidation catalyst.
 9. The processdischarge gas polluted material removal device with a regenerating meansof a polluted oxidation catalyst of claim 8, wherein: the plasma reactoris selectively connected to the first oxidation catalyst tower and thesecond oxidation catalyst tower through a third control valve.
 10. Theprocess discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst of claim 2, furthercomprising: a first control valve provided in front of the oxidationcatalyst tower and intermitting the process discharge gas supplied tothe oxidation catalyst tower and having the first temperature; and asecond control valve provided behind the oxidation catalyst tower andintermitting the process discharge gas supplied to the oxidationcatalyst tower and having the second temperature.
 11. The processdischarge gas polluted material removal device with a regenerating meansof a polluted oxidation catalyst of claim 10, wherein: the plasmareactor is installed on a bypass pipe connecting the first control valveand the second control valve to each other and generates a plasmareaction by the process discharge gas circulated through a closed loopformed by selection operations of the first control valve and the secondcontrol valve and having the first temperature and separately suppliedair to generate the synthesis gas including the hydrogen and having thehigh temperature of 300° C. or more.
 12. The process discharge gaspolluted material removal device with a regenerating means of a pollutedoxidation catalyst of claim 1, further comprising: an ozone generatorconnected to the oxidation catalyst tower in front of the oxidationcatalyst and supplying ozone.
 13. The process discharge gas pollutedmaterial removal device with a regenerating means of a pollutedoxidation catalyst of claim 12, further comprising: a bypass pipe havingone side connected to the oxidation catalyst tower behind the oxidationcatalyst and the other side connected to the pipe through a firstcontrol valve so that the process discharge gas bypasses the oxidationcatalyst.
 14. The process discharge gas polluted material removal devicewith a regenerating means of a polluted oxidation catalyst of claim 13,wherein: the oxidation catalyst tower includes a first oxidationcatalyst tower and a second oxidation catalyst tower disposed inparallel with each other and selectively connected to the selectivecatalytic reduction by a second control valve, and the first controlvalve selectively connects the pipe to the first oxidation catalysttower and the second oxidation catalyst tower in front of the oxidationcatalyst.
 15. The process discharge gas polluted material removal devicewith a regenerating means of a polluted oxidation catalyst of claim 14,wherein: a supply pipe connected to the plasma reactor and the ozonegenerator to selectively supply the hydrogen and the ozone selectivelyconnects the plasma reactor to the first oxidation catalyst tower andthe second oxidation catalyst tower through a third control valve, andselectively connects the ozone generator to the first oxidation catalysttower and the second oxidation catalyst tower through a fourth controlvalve.
 16. The process discharge gas polluted material removal devicewith a regenerating means of a polluted oxidation catalyst of claim 14,wherein: the first oxidation catalyst and the second oxidation catalystare formed in one stage or plural stages within the first oxidationcatalyst tower and the second oxidation catalyst tower, respectively.17. The process discharge gas polluted material removal device with aregenerating means of a polluted oxidation catalyst of claim 11,wherein: air supplied to the plasma reactor is set to 10 to 100% of acombustion equivalent ratio.
 18. The process discharge gas pollutedmaterial removal device with a regenerating means of a pollutedoxidation catalyst of claim 10, wherein: the reduction catalyst tower isprovided behind the oxidation catalyst tower.
 19. The process dischargegas polluted material removal device with a regenerating means of apolluted oxidation catalyst of claim 18, wherein: the first controlvalve intermits the process discharge gas supplied from the pipe to theoxidation catalyst tower and having the first temperature, and thesecond control valve intermits the process discharge gas supplied fromthe oxidation catalyst tower to the reduction catalyst tower and havingthe second temperature.
 20. The process discharge gas polluted materialremoval device with a regenerating means of a polluted oxidationcatalyst of claim 10, wherein: the reduction catalyst tower is providedin front of the oxidation catalyst tower and is connected to the pipe,and a heat exchanger is installed on the pipe and a rear pipe of theoxidation catalyst tower.
 21. The process discharge gas pollutedmaterial removal device with a regenerating means of a pollutedoxidation catalyst of claim 20, wherein: the first control valveintermits the process discharge gas supplied from the reduction catalysttower to the oxidation catalyst tower and having the first temperature,and the second control valve intermits the process discharge gassupplied from the oxidation catalyst tower to the heat exchanger andhaving the second temperature.
 22. A process discharge gas pollutedmaterial removal method with a regenerating means of a pollutedoxidation catalyst, comprising: a first step of blocking a processdischarge gas to allow the process discharge gas to bypass a poisonedoxidation catalyst, in order to regenerate the poisoned oxidationcatalyst; a second step of supplying hydrogen generated by driving aplasma reactor to the poisoned oxidation catalyst to remove an inorganicmaterial of the poisoned oxidation catalyst; a third step of blockingthe supply of the hydrogen by stopping an operation of the plasmareactor when a predetermined time elapses after the plasma reactor isdriven; a fourth step of supplying ozone generated by driving an ozonegenerator to the poisoned oxidation catalyst to remove an organicmaterial of the poisoned oxidation catalyst; and a fifth step ofblocking the supply of the ozone by stopping an operation of the ozonegenerator, releasing the bypass of the process discharge gas for thepoisoned oxidation catalyst, and introducing the process discharge gasinto the poisoned oxidation catalyst, when a predetermined time elapsesafter the ozone generator is driven.
 23. The process discharge gaspolluted material removal method with a regenerating means of a pollutedoxidation catalyst of claim 22, wherein: in the first step, theoxidation catalyst poisoned by the inorganic material is regenerated ina condition in which a temperature of the process discharge gas ishigher than a set value (350° C.).
 24. The process discharge gaspolluted material removal method with a regenerating means of a pollutedoxidation catalyst of claim 22, wherein: the third step is performed ata temperature of the process discharge gas higher than a set value toremove the inorganic material, and the fourth step is performed at atemperature of the process discharge gas lower than the set value tooxidize and remove the organic material.